對用於標準的COF工藝的融除程序進行分析和特徵描述,以便設計一種新的對裸露的MEMS器件熱損壞的潛在*最小的程序
結果表明:COF比COG的剪切強度高。
30μm/25μm Line/Spacing COF Fine Line Production with Conventional Method
Tape Carrier for TAB/COF and Its Surface Finishing
Fine Pitch Wiring Formation of COF Tape for Large Scale LCD
The grade has been designed primarily for glass run channel corner molding applications that require a low coefficient of friction (COF).?
Development and Testing of New High Performance COF Substrate for LCD Television