“bonder”簡單造句，bonder造句子

This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.

Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.

An experimental platform of the IC die bonder has been manufactured, and parameters such as moving precision and position accuracy have been measured by using image recognition technology.

Now, Shusen provides the service such as the process of foam sprinkler, colour stripe, super bonder etc, we do our best to provide more products and service for customers.

The internal quality of HTS/977-2 and HTS/MTM44-1 plates with various repair layers cured by hot bonder was analyzed with optical microscope.