No back plate growing method is to electroform metal microstructure on the metal substrate directly by low-cost UV-LIGA technology based on SU-8 photoresist.
分析了現有的精細金屬網板製造工藝的優缺點，提出了採用基於SU-8光刻膠的UV-LIGA技術來製備大厚度高開孔率精細金屬網板的工藝方法。
本文介紹用於微型機械LIGA工藝的精密電鑄設備。
本文主要闡述了LIGA技術的工藝過程，包括X*線深層光刻、微電鑄和微複製工藝。
A precision plating device applied to LIGA technology is introduced in this paper.
無背板生長法是利用SU - 8光刻膠，通過低成本的UV - LIGA技術，直接在金屬基板上電鑄鎳圖形來實現的。
This article mainly explains the process of LIGA technology, which includes X-ray mask lithography, Micro-electroforming and Micro-copy.
The paper introduces emphatically the making step and method of X -ray lithograph etching in LIGA technology.
着重介紹了LIGA工藝中X*線光刻掩模的製作步驟和方法。
The Design and Fabrication of Chip-based Capillary Electrophoresis by UV-LIGA Technology;
Some Microelectromechanical Systems and Related LIGA Techniques
國文精選館
