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發表於:2017-01-11
Thesevendorfunctionsmustbeintegratedforfunctionssuchaswaferfabrication,wafertest,modulebuild,andmoduletest.Toshibadidnotsayhowmanyitswaferfabshavebeendirectlyaffectedbyev...
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發表於:2021-08-13
ModelingtechnologyforsemiconductorwaferfabricationsystembasedonAgent-orientedknowledgecoloredtimedPetrinetIttakesaround13cubicmetresoffreshwatertoproduceasingle200mmsemic...
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發表於:2018-07-22
Nowpeoplecanproduceawafersilicon.Sheopenedhermouthtoreceivethepapery-thinwafer.Thesevendorfunctionsmustbeintegratedforfunctionssuchaswaferfabrication,wafertest,modulebuil...
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發表於:2018-07-24
Thispaperdiscussesatruewaferlevelpackaging(WLP)technologywhichiscalledUltraCSPTM.Electrostaticbondingisanimportantencapsulatingmeansforthematerialsatthechiporwaferlevel.R...
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發表於:2017-03-25
Normallysiliconwafersarecutfromalargerpieceofsilicon.Thiswastesabouthalfofthewafermaterial.Asiliconwaferchipmanufacturertriestocloseadealwithasolventservicecompany.Thenew...
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發表於:2018-12-06
Thesevendorfunctionsmustbeintegratedforfunctionssuchaswaferfabrication,wafertest,modulebuild,andmoduletest.Modelingtechnologyforsemiconductorwaferfabricationsystembasedon...
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發表於:2018-07-30
Themachineiswidelyappliedtotransparentfilm3Dautomaticpackagesinbulkpoker,sachima,newspaperstick,scribblingpaper,waferbiscuitandotherrelatedbulkthings.Examplesofhighsatura...