It is difficult to guarantee the quality by earlier checking, so the wire bonding is one of the key factors affecting the SAW filter's performance and reliability.
The bonding plan which made by process engineers according to pads with different sizes greatly influences the wire bonding quality.
Thermal-structural analysis was performed for ultrasonic wire bonding(UWB) by three dimensional finite element method(FEM).
Design of welding pressure control system for ultrasonic gold wire bonding machine
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
Ultrasonic wire bonding between Au contact electrode of CdZnTe wafer and down-lead wire
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
The wire bonding failure of devices is mainly shown as the breaking off of wire bonded on the packages after temperature test, and the failure causes are related to wire bonding process and materials.
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